IEEE P1386.1 DRAFT 2.2 PCI PDF

Introduction. (This introduction is not part of IEEE Std P, DraftStandard for a Common Mezza- The mezzanine card’s local bus can be PCI, SBus orother local buses as they are developed in the . Relationship Between VME, VME64 and VMEbus. .. Other Host PCB Mechanics. Compatibility – IEEE P PMC module which complies to PCI Local Bus Specification Revision Provides one multifunction interrupt. 5V signaling. Created for compact PCI Mezzanine Card site rack-based system designs, the read-writer’s form factor (PMC) conforms to the PMC IEEE P/Draft

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Drawings are not to scale. Only one change was made to draft 2. Since the mezzanine card side 1 faces the host, the power dissipated on side 1 is also limited to minimize heat build up between the host and the mezzanine card. Drzft draft standard defines the mezzanine card mechanics for these types of applications.

The Netra CP board also has a solder side cover pck. Standoffs are required to be tied to the mezzanine card’s circuit ground.

Standoffs are used to maintain the spacing between the CMC and the host, and to provide mechanical rigidity. The size of these holes depends on how the standoffs are permanently attached to the CMC during assembly.

It is recommended that mezzanine card vendors list the shock and vibration standards, and to which level s that are met in the product specifications. Definitions, Abbreviations and Terminology Any figure that was changed will have a charge bar on the right side of the figure title.

The labeling of each pin within each connector shall also follow the pin numbering scheme shown in Figure Depending on the functionality of the host, anywhere from one to four connectors may be used, and in any combination.

This defines the actual dimensions of a 25 mm metric equipment practice. Once the host has determined which modes the CMC cards can support, it sets the mode of operation to that which all the cards are capable of supporting.

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They are also used when extending this standard with additional dimensions where such extensions are permitted and when alternative positions of piece parts are described. Note that a low logic level “L” has a voltage that is lower less than than the high logic level “H”.

Common Mezzanine Card – CMC – PH

More isolation may be required depending on system requirements. This logic should be combinatorial in nature as there is a minimum time of 10 bus clock cycles in which to respond to a change in the BUSMODE[4: References The following publications are used in conjunction with this standard: NEBS Level 3 specification compliance.

Use of information contained in this unapproved draft is at your own risk. Every IEEE standard is subjected to review at least once every five years for revision or reaffirmation.

TP is defined as some point on a mezzanine card’s PCB, near the connector s rdaft, that is used by the assembly equipment for the reference positioning of the connector s prior to soldering. Mezzanine card suppliers may design and manufacture mezzanine cards to meet higher shock and vibration performance levels as well as meet other national and international shock and vibration standards, so long as the minimum requirements specified in this standard are met.

Other stacking heights can be used as well, as long as all the associated connector and shoulders are increased by the same height. Basic Dimensions are to be true position within.

VME carrier Board with 2 PMC slots – Ewas Technologies

pcl Note that the CMC side 1 reference plane may be the top surface of the solder coated surfaces for the connector contacts.

In some applications, it may be necessary to use taller or shorter components on a CMC. The reason for the extra 1 mm of space is for electrical clearance and air flow. In such cases, it is obvious that the relationships between involved dimensions shall be maintained. For hosts that support the 10 mm stacking height between the host and the mezzanine card, the 5.

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PCI Bus, PC CardBus, PCMCIA, Reader Writer, Mezzanine PMC

The values in the table are taken relative to the signal levels presented on the bussed signals. CMC boards should meet class B emissions and a minimum of performance criteria B for immunity. All printed wiring boards PWBs are manufactured by UL recognized manufacturers, and have a flammability rating of V0 or better. It shall fit between both the top and bottom handles. See Figure for this dimension.

Multiple mechanical implementations fragments the market and destroys economy 22 scale for manufacturing, engineering, sales and marketing. Not shown is the spacer for the CMC bezel.

A P P E N D I X D – Bibliography

This section provides information on power sequencing and power requirements by connection phase. For desktop computers, portable computers, servers and other types of computers with face plates, the mechanics of the CMC slot opening l1386.1 be derived from the mechanics in Figures through This draft standard defines the mechanics of a common mezzanine card family. In the future, additional child standards can be developed that use the basic mechanical definition from this standard but have different local buses.

As stated in section 4. These two sizes are listed in Table The center of the bezel shall be within the tolerance specified in Figure and the standoffs with the numbers given in Table When the CMC is placed 13 mm above the host, the host component height under this area shall not exceed 2 mm.

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